
of Hierarchically Structured Graphene/Silicon Carbide
We have investigated various kinds of nanowires (Si, Bi2Te3, SiGe) in order to evaluate the influence of the nanostructuration on their thermal t
We have investigated various kinds of nanowires (Si, Bi2Te3, SiGe) in order to evaluate the influence of the nanostructuration on their thermal t
A silicon nitride substrate including silicon nitride crystal grains and a grain boundary phase and having a thermal conductivity of 50 W/m·K or more,
Abstract: Thermal transport behavior in nanostructures has become increasingly important for understanding and designing next generation electronic and
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gas pressure sintering and thermal conductivity of silicon nitride with the sample without MgSiN2 exhibits the coarsest and highest bimodal
that of the bulk, which will also tend to reduce the thermal conductivity Fabrication of Silicon Carbide Photodiodes with Enhanced High-Temperature
Minimizing conductive heat losses in Micro-Electro-Mechanical-Systems (MEMS) thermal (hot-film) flow sensors is the key to minimize the sensors’
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2004112-A chemical vapor deposited, .beta. phase polycrystalline silicon carbide having a high thermal conductivity and reduced stacking faults. The
A study was made of the thermal conductivity of silicon carbide, produced by reactive sintering, over the range 200–1650°C. It is shown that the
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Request PDF on ResearchGate | On Jan 1, 1993, D. Morelli and others published Carrier concentration dependence of the thermal conductivity of silicon carb
A silicon carbide semiconductor device includes a first semiconductor layer of a first conductivity type provided on a front surface of a semiconductor
The electrical resistivity and thermal conductivity of high-porosity (∼52 vol %, channel-type pores) bio-SiC samples prepared from sapele wood
In this research paper, the determination of thermal conductivity and thermal diffusivity have been accomplished for Al 6061, Silicon Carbide and Graphite
2018116-Aluminum-(Silicon Carbide) is a metal-ceramic composite material consisting It combines the benefits of high thermal conductivity of metal and low CTE
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thermal conductivity of 0.1 W/mK to such high values as 6600 is placed on a substrate limiting heat losses, usually silicon wafer
of a mixture of graphite nanoplatelets and silicon carbide microparticles T. Owing to the high thermal conductivity (250 W/(m K) in basal plane and
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